Automation for direct imaging and laser direct imaging (LDI)

Our design for automation direct imaging and laser direct imaging (LDI), grants a full-time operation of the Direct Imaging machine. Automation for direct imaging  will be able to cover with full guaranties the loading and unloading of the Direct Imaging machine even with single panels jobs. This mean the automation and the Direct imaging are fully connected and able to change jobs without the need of manual intervention.

Solutions for LDI
automation

The increasing demand for miniaturization and improved functionality of electronic components and devices has a significant effect on the requirements facing the printed circuit board (PCB) industry. PCB manufacturers are driving the production of high-density interconnect (HDI) boards with significantly reduced cost and implementation time. PCB interconnect complexity continues to grow and today requires 50/50 µm or 25/25 µm technology.

Technosystem helps you to optimize the production of your LDI machine and to fully automate it. Combine different jobs and panel sizes, loading and unloading with a single machine. Our machines are fully adapted and designed to meet the needs of our customers, we merge our software with any type of direct imaging machine.
We assure you that the automation will be 100% functional regardless of the brand you are working with, Orbotech, Ucamco, Ledia, Paragon, Nuvogo, Limata…

Automation for direct imaging and laser direct imaging (LDI)

High technology for automation LDI

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Reduced foot print, Technosystem only requires 1.1 meters at the side of the DI.

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High speed performance, less than 19.5 seconds per cycle including roller cleaning, flipping alignment and placing in DI table.
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CCD camera installed in the system combined with our 6 Axis robotic arm are capable to align on the fly all panels with  no time consuming. Alignment includes X, Y and rotation of the panel.
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Technosystem , installs a Fanuc high end robotic arm which grants extremely high reliability of the system.

Advantages with Technosystem LDI automation

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No need to identify the size of the panel. This makes preparation of the loader very easy requiring very short preparation time.

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Cero position of the panel can be in any corner of the panel, selected by customer.

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High speed performance, less than 19.5 seconds per cycle including roller cleaning, flipping alignment and placing in DI table.

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High speed Turning device for side B printing Prepared for 50 micron up to 3,2mm.

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Able to load solder mask panels from slotted racks and dry film panels from L Racks with no need of adjustments.

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Solder mask panels will be loaded vertically and with no contact in between panels on the slotted racks.

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Cycle time for dry film panels picked up from L Rack 12 seconds for panels under 1,0kg  (excluding exchange of the panel)

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 LDI -V3 Loader will only be able to handle double side panels.

Loader / Unloader DI V3

Double arm for dry film/solder mask

LDI Loader V3

Loading Solder Mask Panels

Loader / Unloader DI V3

For Ledia 5

Complements for your machine

L Rack for automation load or unload PCB panels

L Rack

Slotted Rack for automation load or unload PCB panels

Sloted Rack

Trolley for automation load or unload PCB panels

Trolley

We will reply to you as soon as possible.

Phone

+34 935 724 161

Email

benmayor@benmayor.com

Address

Gabriel Benmayor S.A., Pol. Ind. Foinvasa, Carrer Bach, 2B, 08110 Montcada i Reixac, Barcelona

Contact us